FLAGSHIP SUMMIT
Advanced MaterialsAdvanced Summit · China Debut
Academy fellows’ keynotes, a roundtable with leading journal editors, and high-level international exchange for emerging researchers.
Wiley Advanced Summit (Beijing) &International Conference on Advanced Materials and Intelligent Manufacturing + AI 2026 (ICMIA 2026) &Beijing International Academic Season
AI EMPOWERMENT · MATERIALS INNOVATION · INTELLIGENT MANUFACTURING
Bringing together leading scientists, journal editors and industry pioneers to explore a new paradigm for AI-driven materials research and intelligent manufacturing.
Chinese Association of Development Strategy StudiesAdvanced Materials and Intelligent Manufacturing Strategy Committee
DATE6—8 NOVEMBER 2026
LOCATIONSHUNYI · BEIJING · CHINA
GLOBAL REACH500 ONSITE · 20,000+ ONLINE
FIRST ANNOUNCEMENT
01
ABOUT ICMIA
Where materials science and artificial intelligence meet
The conference combines an international flagship summit, parallel symposia, special sessions and supporting activities to connect fundamental research, scholarly publishing and industrial practice.
60Invited Guests
Including 50 international guests
19Academy Fellows
From leading research institutions worldwide
17Journal Editors
From Advanced Materials, Circulation and more
11+Countries & Regions
A global interdisciplinary dialogue
Conference Chairs
CONFERENCE LEADERSHIP
Conference Chair
Zhong Lin Wang
Foreign Member of the Chinese Academy of Sciences
Director, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences
Conference Chair
Jin Zhang
Member of the Chinese Academy of Sciences
Executive Vice President, Peking University
Conference Chair
Jianbin Luo
Member of the Chinese Academy of Sciences
Dean, School of Mechanical Engineering, Tsinghua University
Conference Chair
Sanjay Mathur
Member of Academia Europaea
Director, Institute of Inorganic Chemistry, University of Cologne
Conference Chair
Yuanhua Lin
Member of the Chinese Academy of Sciences
Dean, School of Materials Science and Engineering, Tsinghua University02
ACADEMIC PROGRAM
Seven themes shaping the future of intelligent manufacturing
With AI as a central force, the program spans materials discovery, manufacturing processes, intelligent sensing, biomedical engineering, new energy, scholarly communication, superconductivity and two-dimensional materials.
01PARALLEL SYMPOSIUM
Advanced Materials and AI Empowerment
Exploring a new paradigm for AI-driven materials research, from data-driven design and intelligent experimentation to autonomous discovery across the full innovation pipeline.
SYMPOSIUM CHAIRSLongfei Wang · Ke Liu · Fei Wu · Libo Chen · Kirsten Severing
Longfei Wang
Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
Ke Liu
Peking University, China
Fei Wu
Chongqing University, China
Libo Chen
Uppsala University, Sweden
Kirsten Severing
02PARALLEL SYMPOSIUM
Intelligent Manufacturing and Process Innovation
Digital twins, intelligent process control, AI-enabled precision manufacturing and ultraprecision machining.
SYMPOSIUM CHAIRSWenbo Ding · Renyun Zhang · Richard Murray
03PARALLEL SYMPOSIUM
Intelligent Sensing and Next-Generation AI
Intelligent sensors, AIoT, triboelectric nanogenerators and self-powered systems.
SYMPOSIUM CHAIRSJunyi Zhai · Zhen Wen · Gulnur Kalimuldina · Esther Levy
Junyi Zhai
Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
Zhen Wen
Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, China
Gulnur Kalimuldina
Department of Mechanical and Aerospace Engineering, Nazarbayev University, Kazakhstan
Esther Levy
04PARALLEL SYMPOSIUM
Biomedical Engineering and Intelligent Materials Design
Biomedical materials, intelligent medical devices and AI-assisted design of drug-delivery carriers.
SYMPOSIUM CHAIRSYanglong Hou · Dan Luo · Neville Compton
05PARALLEL SYMPOSIUM
New Energy Materials and Green Manufacturing
New-energy materials, green manufacturing and materials innovation for carbon neutrality, including high-energy-density batteries, performance at ultra-low and high temperatures, fast charging, and AI-assisted battery-material design.
SYMPOSIUM CHAIRSShuhui Sun · Shaojun Guo · Xinmei Hou · Jianmin Ma · Shuhong Jiao · Till von Graberg
06PARALLEL SYMPOSIUM
AI-Empowered Science Communication and Academic Publishing
Large language models for research writing, leading-journal submission strategies and academic writing skills.
SYMPOSIUM CHAIRSJian Li · Jiuhong Qian · Theresa Kueckmann
SSPECIAL FORUM
Special Forum on Superconductivity and 2D Materials
Superconducting-material preparation and applications, AI-driven optimisation of superconducting materials, and the preparation, properties and applications of emerging two-dimensional materials.
SYMPOSIUM CHAIRSHaihu Wen · Jiadong Zhou · Jinxing Zheng · Huajun Liu · Qingquan Qiu · Joern Ritterbusch
Haihu Wen
Session Chair
Nanjing University, China
Jiadong Zhou
Session Chair
Beijing Institute of Technology, China
Jinxing Zheng
Session Chair
Institute of Plasma Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences
Huajun Liu
Session Chair
Institute of Plasma Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences
Qingquan Qiu
Session Chair
Institute of Electrical Engineering, Chinese Academy of Sciences
Joern Ritterbusch
Editor-in-Chief
Advanced Functional Materials
03
INVITED COMMUNITY
A world-class academic community
The conference plans to invite internationally renowned scientists, major award recipients and editors of leading journals. The participants below are selected from the first announcement; the final line-up is subject to the official program.
19
Academy Fellows
PLANNED INVITATIONS9
international award recipients
Konstantin Novoselov
Nobel Laureate in Physics
Zhong Lin Wang
Foreign Member, Chinese Academy of Sciences
Jianbin Luo
Member, Chinese Academy of Sciences
Zhongfan Liu
Member, Chinese Academy of Sciences
Ce-Wen Nan
Member, Chinese Academy of Sciences
Gehan A. J. Amaratunga
Fellow, Royal Academy of Engineering
Lars Samuelson
Member, Royal Swedish Academy of Sciences
Rodrigo Martins
Member, Portuguese Academy of Engineering
Sanjay Mathur
Member, Academia Europaea
Oliver Schmidt
Member, German Academy of Science and Engineering
Zuankai Wang
Fellow, Hong Kong Academy of Engineering Sciences
Zhiyong Fan
Fellow, Hong Kong Academy of Engineering Sciences
TOP JOURNAL EDITORS
Top Journal Editors: 17
Editors-in-chief and editorial-board members from journals including Advanced Materials and Circulation. The first two featured guests are shown below.
Allyn Molina
Vice President, Publishing Development, Wiley
Hoboken, United States
Louisa Flintoft
Senior Director, Materials Science, Wiley
London, United Kingdom
Academic Committee Chair
Zhongfan Liu
刘忠范
Member, Chinese Academy of Sciences
Academic Committee Chair
Ce-Wen Nan
南策文
Member, Chinese Academy of SciencesChairs: Zhongfan Liu, Ce-Wen Nan, Hexing Li, Rodrigo Martins
Vice Chairs: Jun Chen, Zhiyong Fan, Gehan A. J. Amaratunga, Shirong Ge, Lars Samuelson, Xianping Luo, Oliver Schmidt, Zuankai Wang, Zhenghe Xu, Jianmin Zhang, Liqun Zhang, Pingxiang Zhang, Quanshui Zheng
Organising Committee Chair & Secretary-General
Jiuhong Qian
钱九红
Organising Committee Member
Louisa Flintoft
Senior Director, Materials Science, WileyLondon, United KingdomChairs: Jiuhong Qian, Louisa Flintoft, Moyi Zhang, Junyi Zhai
Vice Chairs: Jian Li, Wen Ma, Jie Xu
Secretary-General: Jiuhong Qian Deputy Secretary-General: Jianyun Lin
04
CALL FOR PAPERS
Bring your research to an international stage
Original English-language papers are invited in advanced materials, intelligent manufacturing and interdisciplinary AI applications. Following recommendation by the Academic Committee, authors of outstanding work may choose to submit to relevant Wiley journals, including Advanced Materials.Editorial assessment, peer review and final acceptance of journal submissions are determined independently by each journal according to its own editorial standards.
TOPICS
- 01Advanced Materials and AI Empowerment
- 02Intelligent Manufacturing and Process Innovation
- 03Intelligent Sensing and Next-Generation AI
- 04Biomedical Engineering and Intelligent Materials Design
- 05New Energy Materials and Green Manufacturing
- 06Superconductivity and 2D Materials
FULL-PAPER SUBMISSIONsubmission@icmia.net ↗
LanguageEnglish
RequirementOriginal and unpublished
ProceedingsPublished after the conference (EI indexed)
10.052026
Early-bird registration deadline
10.102026
Oral and poster application deadline
11.06—082026
Conference dates
11.302026
Full-paper submission deadline
03.302027
Paper acceptance notification
ORAL & POSTER
Presentations and Posters
- Invited presentations: 25 minutes; contributed presentations: 15 minutes
- Poster size: 80 cm (W) × 120 cm (H)
- All presentations and posters must be in English
APPLICATION DEADLINE10 OCT 2026
05
ATTEND & EXHIBIT
Attendance and partnership information
The first-announcement fees and partnership information are shown below, with access to registration, sign-in and payment interfaces. This local preview is not connected to real email or payment services.
REGISTER TO ATTEND · FEES
EARLY BIRD DEADLINE5 OCTOBER 2026STANDARD
Standard
¥3,000EARLY BIRD / PERSON
Regular ¥3,800
For delegates from universities, institutes and industry
Register now ↗MEMBER
CADSS Member
¥2,700EARLY BIRD / PERSON
Regular ¥3,420
A 10% discount for active committee members
Register now ↗NEW MEMBER
New CADSS Member
¥2,800EARLY BIRD / PERSON
Regular ¥3,520
Includes one year of membership and member pricing
Register now ↗STUDENT
Student
¥2,000EARLY BIRD / PERSON
Regular ¥2,500
Valid student identification is required
Register now ↗Fees exclude accommodation, travel and publication charges where applicable. Students may join CADSS free of charge. Payment instructions will follow in a later announcement.
EXHIBITION & SPONSORSHIP
AI Empowerment ·
Intelligent Future
For international organisations and companies in scholarly publishing and knowledge services, advanced materials and intelligent manufacturing, and interdisciplinary applications.
STANDARD BOOTH · 2m × 3m¥15,000PER BOOTH / EVENT
Request partnership information ↗06
ORGANIZATIONS
Organisations
HOSTS
- Advanced Materials and Intelligent Manufacturing Strategy Committee, Chinese Association of Development Strategy Studies
- John Wiley & Sons (Wiley)
CO-ORGANISERS
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences
- Superconductivity Application Technology Committee, China Electrotechnical Society
- Beijing Digital Bee Technology Co., Ltd.
SUPPORTERS
- School of Materials Science and Engineering, Tsinghua University
- China University of Mining and Technology–Beijing